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US 2018/0124952 A1Published application
Modular dewar system
AssigneeUniversity of Delaware
InventorsFouad E. Kiamilev, Andrea Waite
Life of this patent
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Abstract
An embodiment includes a modular dewar comprising a vacuum chamber, and a dewar circuit board. The dewar circuit board includes an inner portion including an electronic device positioned inside the vacuum chamber, an outer portion including electrical connectors positioned outside the vacuum chamber, and electrical traces connecting the electronic device inside the vacuum chamber to the electrical connectors outside the vacuum chamber.
Claims21
A modular dewar comprising:
- a vacuum chamber;
- and
- a dewar circuit board including:
- an inner portion including an electronic device positioned inside the vacuum chamber,
- an outer portion including electrical connectors positioned outside the vacuum chamber, and
- electrical traces connecting the electronic device inside the vacuum chamber to the electrical connectors outside the vacuum chamber.
3 more elements
A circuit board for cryo-packaging, the circuit board comprising:
- an inner portion including an electronic device, the inner portion having a first predetermined geometry for positioning inside a vacuum chamber;
- an outer portion including electrical connectors, the outer portion having a second predetermined geometry for positioning outside the vacuum chamber with the inner portion positioned inside a vacuum chamber;
- and
- electrical traces connecting the electronic device to the electrical connectors.
1 more element
A modular dewar comprising:
- a vacuum chamber defined by a front lid and a rear lid;
- an interposer comprising an electrically insulating substrate having a first face in contact with a first vacuum seal in contact with the front lid and a second face in contact with a second vacuum seal in contact with the rear lid, the interposer comprising:
- an inner portion positioned inside the vacuum chamber and containing a first electronic component,
- an outer portion positioned outside the vacuum chamber and containing one or more second electronic components, and
- electrically conductive layers or members;
- and
- a temperature regulation device configured to cool the dewar,
- wherein the modular dewar is configured to permit exchanging the first electronic component for a second electronic component different than the first electronic component without requiring modifications to the modular dewar.
5 more elements
Dependencies are inferred from the claim text.