Heat dissipation module and electronic device having the same
AssigneeSynology Incorporated
InventorCheng-Huang LEE
Life of this patent
Estimating the term…
Abstract
A heat dissipation module is provided. The heat dissipation includes a base, a frame, and a positioning member. The frame is disposed on the base and has a passage for containing an electronic component. At least a segment of the edge of the frame that is adjacent to the base is distant from the base so as to form an air path inlet that communicates with the passage therebetween. The positioning member is disposed in the passage and is connected to the frame and configured to position an electronic assembly in the frame.
Claims15
A heat dissipation module, adapted for positioning an electronic assembly, comprising:
- a base;
- a frame disposed on the base and having a passage for receiving the electronic assembly, wherein at least one segment of an edge of the frame that is adjacent to the base is distant from the base, and an air path inlet is formed between the at least one segment of the frame and the base and communicates with the passage;
- and
- a positioning member disposed in the passage and connected to a surface of the frame;
- wherein when the electronic assembly is disposed in the passage, the electronic assembly is abutted against the positioning member, and there is a gap formed between the positioning member and the surface that allows an air current to flow through.
An electronic device, adapted for receiving an electronic assembly, comprising:
- a base having an upper surface and a lower surface that is positioned relative to the upper surface, wherein a through hole penetrates the upper surface and the lower surface of the base;
- a circuit board disposed on the lower surface of the base, and comprising an electronic connector disposed in the through hole and exposed by the upper surface;
- a frame disposed on the upper surface of the base and having a passage facing the electronic connector, wherein at least a segment of an edge of the frame that is adjacent to the base is distant from the base, and an air path inlet is formed between the segment of the edge of the frame and the base, the air path inlet communicates with the passage;
- and
- a positioning member is disposed in the passage and is connected to a surface of the frame;
- wherein when the electronic assembly is disposed in the passage, the electronic assembly is abutted against the positioning member and is electrically connected to the electronic connector, and there is a gap formed between the positioning member and the surface that allows an air current to flow through.
Dependencies are inferred from the claim text.