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US 2018/0124927 A1Published application
Contact structures with porous networks for solder connections, and methods of fabricating same
AssigneeInvensas Corporation
InventorsLiang WANG, Rajesh KATKAR, Hong SHEN, Cyprian Emeka UZOH
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Abstract
A contact pad includes a solder-wettable porous network (310) which wicks the molten solder (130) and thus restricts the lateral spread of the solder, thus preventing solder bridging between adjacent contact pads.
Claims18
An assembly comprising:
- a first component comprising a substrate and circuitry supported by the substrate, the circuitry comprising one or more contact pads;
- and
- a second component comprising a substrate and circuitry supported by the substrate, the circuitry of the second component comprising one or more contact pads each of which is attached to a contact pad of the first component by a connection comprising:
- an open-pore porous network;
- and
- solder in pores of the open-pore porous network.
3 more elements
An assembly comprising:
- a first component comprising circuitry comprising one or more contact pads;
- and
- a second component comprising circuitry comprising one or more contact pads each of which is attached to a contact pad of the first component by a connection comprising solder in pores of an open-pore porous network;
- wherein each said connection comprises a segment within which an entire exterior surface of the connection is in physical contact with first dielectric.
1 more element
A fabrication method comprising:
- obtaining a first component comprising circuitry comprising one or more contact structures, each contact structure comprising an open-pore porous network;
- obtaining a second component comprising circuitry;
- attaching the first component to the second component using solder in pores of the open-pore porous network at each contact structure.
Dependencies are inferred from the claim text.