Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board

Abstract

According to an embodiment of the present invention, a substrate for a printed circuit board, the substrate including a resin film and a metal layer deposited on at least one surface of the resin film, includes a modified layer on the surface of the resin film on which the metal layer is deposited, the modified layer having a composition different from another portion, in which the modified layer contains a metal, a metal ion, or a metal compound different from a main metal of the metal layer. The content of a metal element of the metal, the metal ion, or the metal compound on a surface of the modified layer is preferably 0.2 atomic % or more and 10 atomic % or less.

Dependencies are inferred from the claim text.