Power module with lead component and manufacturing method thereof

A manufacturing method of a power module, comprising:

• (a) providing a carrier board and at least one lead component, wherein the lead component comprises at least one initial plane and plural pins;
• (b) stacking and disposing the lead component on the carrier board, wherein a vertical projection of the initial plane at least partially overlaps with the carrier board;
• and
• (c) forming at least one isolation gap to separate the initial plane into a first plane and a second plane and divide the pins into at least one first pin and at least one second pin, wherein the first pin and the second pin are electrically isolated from each other, the first pin is electrically connected to the first plane, and the second pin is electrically connected to the second plane.

A manufacturing method of a power module, comprising:

• (a) providing a panel and plural lead components, wherein the panel includes plural carrier boards arranged in an array, and each lead component comprise at least one initial plane and plural pins;
• (b) stacking and disposing the lead components on the corresponding carrier boards in an array arrangement, wherein a vertical projection of the initial plane of each the lead component at least partially overlaps with the corresponding carrier board;
• (c) forming at least one isolation gap to separate the initial plane of each lead component in the array arrangement into at least one first plane and at least two second plane and divide the pins of each lead component into at least one first pin and at least one second pin, wherein the first pin and the second pin are electrically isolated from each other, the first pin is electrically connected to the first plane, and the second pin is electrically connected to the second plane;
• and
• (d) cutting the panel to form plural power modules.

A lead component for a power module, wherein the power module comprises a carrier board and at least one isolation gap, and the lead component is disposed on the carrier board, the lead component comprising:

• at least one initial plane, wherein the initial plane includes at least one pad, and a vertical projection at least partially overlapping with the carrier board;
• at least one first pin electrically connected to the carrier board, wherein the first pin is vertical to the initial plane;
• and
• at least one second pin electrically connected to the carrier board, wherein the second pin is vertical to the initial plane;
• wherein the isolation gap is located between the first pin and the second pin, wherein the initial plane is separated into a first plane and a second plane by the isolation gap, so as to electrically isolate the first pin and the second pin from each other.