System and method for improving isolation in high-density laminated printed circuit boards
AssigneeLockheed Martin Corporation
InventorJack V. Ajoian
Life of this patent
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Abstract
A system and method of isolating a layer-to-layer transition between conductors in a multilayer printed circuit board includes formation of a first ground via at least partially surrounding a first signal conductor in at least one layer of the printed circuit board and formation of a second ground via at least partially surrounding a second signal conductor in another layer of the printed circuit board. The first and second ground vias are plated with a conductive material.
Claims20
A method of manufacturing a multilayer printed circuit board comprising:
- forming a first signal conductor on a surface of a first dielectric layer;
- forming a second dielectric layer on the first signal conductor;
- forming a first metal layer on a surface of the second dielectric layer opposite the first signal conductor;
- forming a third dielectric layer on the first metal layer;
- forming a second signal conductor on a surface of the third dielectric layer opposite the first metal layer;
- forming a via extending through at least a portion of the first, second and third dielectric layers and electrically connecting a first end of the first signal conductor to a first end of the second signal conductor;
- forming a first ground via at least partially surrounding the first end of the second signal conductor;
- and
- forming a second ground via at least partially surrounding the first end of the first signal conductor and extending from the first metal layer through the first dielectric layer.
A method of isolating layer-to-layer transitions between conductors in a multilayer printed circuit board comprising:
- forming a printed circuit board including:
- a plurality of dielectric layers including first, second and third dielectric layers;
- a first signal conductor arranged on a surface of the first dielectric layer, and a second signal conductor arranged between the second dielectric layer and the third dielectric layer;
- and a via extending through at least a portion of the plurality of dielectric layers and electrically connecting a first end of the first signal conductor to a first end of the second signal conductor;
- surrounding the first end of the first signal conductor at least partially with a first ground via;
- and
- surrounding the first end of the second signal conductor at least partially with a second ground via, the second ground via extending from a metal layer arranged between the first dielectric layer and the second dielectric layer and through the third dielectric layer.
Dependencies are inferred from the claim text.