Tamper-respondent assemblies with trace regions of increased susceptibility to breaking

A tamper-respondent assembly comprising:

• an electronic enclosure to enclose, at least in part, at least one electronic component to be protected, the electronic enclosure comprising an inner surface;
• a tamper-detect sensor comprising at least one flexible layer with tamper-detect circuit lines, the tamper-detect sensor covering, at least in part, the inner surface of the electronic enclosure and facilitating defining a secure volume about the at least one electronic component;
• at least one conductive trace forming, at least in part, at least one tamper-detect network of the tamper-respondent assembly, the at least one conductive trace being exposed, at least in part, on the tamper-detect sensor;
• an adhesive contacting the at least one conductive trace on the at least one tamper-detect sensor, the adhesive being disposed, at least in part, between and coupling a surface of the tamper-detect sensor to another surface of the tamper-respondent assembly;
• and
• the tamper-detect sensor, at least one conductive trace, and adhesive being a subassembly of the tamper-respondent assembly, the subassembly being configured with multiple regions of increased susceptibility to breaking of the at least one conductive trace with a tamper event through the subassembly.

A method comprising:

• fabricating a tamper-respondent assembly, the fabricating comprising:
• providing a tamper-detect sensor to facilitate defining a secure volume about at least one electronic component to be protected;
• providing at least one conductive trace forming, at least in part, at least one tamper-detect network of the tamper-respondent assembly, the at least one conductive trace being disposed, at least in part, on the tamper-detect sensor;
• providing an adhesive contacting the at least one conductive trace on the tamper-detect sensor, the adhesive being disposed, at least in part, between and coupling a surface of the tamper-detect sensor to another surface of the tamper-respondent assembly;
• and
• the tamper-detect sensor, at least one conductive trace, and adhesive being a subassembly of the tamper-respondent assembly, the subassembly being configured with multiple regions of increased susceptibility to breaking of the at least one conductive trace with a tamper event through the subassembly.