Thermal management structures for optoelectronic modules

An optoelectronic module comprising:

• a module board that includes a printed circuit board (PCB) on a portion of a top surface of the module board;
• a lens assembly that is secured relative to the top surface;
• a thermally conductive plate that defines an opening in which at least a portion of the lens assembly is position, and that includes a rear portion having a bottom surface and plate feet that are secured directly to the top surface of the module board such that the bottom surface of the rear portion is separated from the top surface of the module board by a first dimension;
• a heat-generating component mounted to the PCB and positioned between the bottom surface of the rear portion and the PCB, wherein the first dimension is sized such that the bottom surface of the rear portion of the thermally conductive plate directly physically contacts the heat-generating component to absorb at least a portion of thermal energy generated during operation of the heat-generating component;
• and
• a cover positioned on the module board such that the cover encloses the top surface of the module board, wherein the cover defines a cavity that is bordered by the module board to surround the lens assembly the thermally conductive plate, and the heat-generating component.

An optoelectronic module comprising:

• a module board that includes a printed circuit board (PCB) on a portion of a top surface of the module board;
• a thermally conductive plate that includes a rear portion having a bottom surface and plate feet that are secured directly to the top surface of the module board such that the bottom surface of the rear portion is separated from the top surface of the module board by a first dimension;
• a heat-generating component mounted to the PCB and positioned between the bottom surface of the rear portion and the PCB, wherein the first dimension is sized such that the bottom surface of the rear portion of the thermally conductive plate directly physically contacts the heat-generating component to absorb at least a portion of thermal energy generated during operation of the heat-generating component;
• and
• a cover that defines a cavity and is positioned on the module board, wherein:
• the cavity is defined such that the heat-generating component and the thermally conductive plate are positioned within the cavity and such that the cover and the module board surround the thermally conductive plate and the heat-generating component;
• and
• at least a portion of the thermal energy absorbed by the thermally conductive plate transfers to the cover via thermal conduction.

An optoelectronic module comprising:

• a module board that includes a printed circuit board (PCB) on a portion of a top surface of the module board;
• a thermally conductive plate that includes a rear portion having a bottom surface and plate feet that are secured directly to the top surface of the module board such that the bottom surface of the rear portion is separated from the top surface of the module board by a first dimension;
• a clock and data recovery (CDR) chip mounted to the PCB and positioned between the bottom surface of the rear portion and the PCB, wherein the first dimension is sized such that the bottom surface of the rear portion of the thermally conductive plate directly physically contacts the CDR chip to absorb at least a portion of thermal energy generated during operation of the CDR chip;
• and
• a cover that defines a cavity, wherein the cover is positioned on and encloses the top surface of the module board and the cavity is defined such that the CDR chip and the thermally conductive plate are positioned within the cavity and such that the cover and the module board surround the thermally conductive plate and the CDR chip.