Wired circuit board and producing method thereof

A method for producing a wired circuit board comprising:

• a first step of preparing an insulating layer and
• a second step of disposing a conductive layer at one-side surface in a thickness direction of the insulating layer, wherein
• the insulating layer continuously has
• a first insulating portion,
• a second insulating portion having a thickness smaller than that of the first insulating portion, and
• a third insulating portion disposed between the first insulating portion and the second insulating portion and having a thickness that gradually becomes smaller from the first insulating portion toward the second insulating portion;
• the conductive layer continuously has
• a first conductive portion disposed at one-side surface in the thickness direction of the first insulating portion and
• a second conductive portion disposed at one-side surface in the thickness direction of the second insulating portion and having a thickness smaller than that of the first conductive portion;
• the first conductive portion is further disposed at one-side surfaces in the thickness direction of the second insulating portion and the third insulating portion or
• the second conductive portion is further disposed at one-side surfaces in the thickness direction of the first insulating portion and the third insulating portion;
• the second step includes
• a third step of disposing a first conductive layer having the same thickness as that of the second conductive portion at one-side surface in the thickness direction of the insulating layer,
• a fourth step of disposing a photoresist at the entire one-side surface in the thickness direction of the first conductive layer,
• a fifth step of forming a plating resist in a pattern reverse to the first conductive portion by exposing the photoresist to light to be developed, and
• a sixth step of forming a second conductive layer at one-side surface in the thickness direction of the first conductive layer exposed from the plating resist by plating;
• and
• in the sixth step, plating is performed so that the total thickness of the first conductive layer and the second conductive layer is the same as the thickness of the first conductive portion.

A method for producing a wired circuit board comprising:

• a first step of preparing an insulating layer and.
• a second step of forming a conductive layer at one-side surface in a thickness direction of the insulating layer, wherein
• the insulating layer continuously has
• a first insulating portion,
• a second insulating portion having a thickness smaller than that of the first insulating portion, and
• a third insulating portion disposed between the first insulating portion and the second insulating portion and having a thickness that gradually becomes smaller from the first insulating portion toward the second insulating portion;
• the conductive layer continuously has
• a first conductive portion disposed at one-side surface in the thickness direction of the first insulating portion and
• a second conductive portion disposed at one-side surface in the thickness direction of the second insulating portion and having a thickness smaller than that of the first conductive portion;
• the first conductive portion is further disposed at one-side surfaces in the thickness direction of the second insulating portion and the third insulating portion or
• the second conductive portion is further disposed at one-side surfaces in the thickness direction of the first insulating portion and the third insulating portion;
• the second step includes
• a seventh step of disposing a third conductive layer having the same thickness as that of the first conductive portion at one-side surface in the thickness direction of the insulating layer,
• an eighth step of forming an etching resist at one-side surface in the thickness direction of the third conductive layer in the same pattern as that of the first conductive portion, and
• a ninth step of etching a one-side portion in the thickness direction of the third conductive layer exposed from the etching resist;
• and
• in the ninth step, the third conductive layer is etched by a portion corresponding to the thickness obtained by subtracting the thickness of the second conductive portion from that of the first conductive portion.