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US 2018/0123561 A1Published application
Filter
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsHyun Jun KIM, Won Kyu JEUNG
Life of this patent
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Abstract
A filter includes a multilayer structure comprising films configured as bulk acoustic-wave resonators; and a cap member formed of glass or polymer, accommodating the bulk acoustic-wave resonators and bonded to the multilayer structure.
Claims20
A filter, comprising:
- a multilayer structure comprising films configured as bulk acoustic-wave resonators;
- and
- a cap member formed of glass or polymer, configured to accommodate the bulk acoustic-wave resonators, and bonded to the multilayer structure.
A filter, comprising:
- a multilayer structure configured as bulk acoustic-wave resonators, each of the bulk acoustic-wave resonators comprising a substrate, a first electrode, a piezoelectric layer, and a second electrode, stacked on the substrate,
- a cap member configured to accommodate the bulk acoustic-wave resonators, and bonded to the multilayer structure;
- and
- a shielding layer configured on a lower surface of the substrate.
1 more element
A filter, comprising:
- a substrate;
- bulk acoustic-wave resonators disposed on the substrate;
- and
- a cap member formed of glass disposed to accommodate and seal the bulk acoustic-wave resonators, and bonded to the substrate.
1 more element
Dependencies are inferred from the claim text.