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US 2018/0123557 A1Published application
Filter including bulk acoustic wave resonator
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJung Woo SUNG, Yoon Sok PARK, Won Kyu JEUNG
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Abstract
A filter includes a multilayer structure comprising films and forming bulk acoustic wave resonators, a cap accommodating the bulk acoustic wave resonators and bonded to the multilayer structure, a bonding agent disposed in a bonded area between the multilayer structure and the cap and comprising a bonding layer, and a shielding layer disposed on an inner surface of the cap and comprising a same material as at least a portion of the bonding layer.
Claims18
A filter, comprising:
- a multilayer structure comprising films and forming bulk acoustic wave resonators;
- a cap accommodating the bulk acoustic wave resonators and bonded to the multilayer structure;
- a bonding agent disposed in a bonded area between the multilayer structure and the cap and comprising a bonding layer;
- and
- a shielding layer disposed on an inner surface of the cap and comprising a same material as at least a portion of the bonding layer.
2 more elements
A filter, comprising:
- a multilayer structure comprising films and forming bulk acoustic wave resonators;
- a cap accommodating the bulk acoustic wave resonators, comprising a hexahedral shape having an open a bottom surface, and bonded to the multilayer structure;
- and
- a shielding layer disposed on an inner surface of the cap,
- wherein a distance between the shielding layer and the multilayer structure is in a range of 15 μm to 45 μm.
2 more elements
Dependencies are inferred from the claim text.