Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3d systems
AssigneeNuvotronics, LLC
InventorsJean-Marc Rollin, J. Robert Reid, David Sherrer, Will Stacy, Ken Vanhille, J. Marcus Oliver, Tim Smith
Life of this patent
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Abstract
Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems.
Claims22
A microstructure, comprising:
- a first microstructural element having a plurality of fused layers of a material, each layer parallel to an upper surface of the first microstructural element, the first microstructural element having a first mating edge;
- a second microstructural element having a plurality of fused layers of a material, each layer parallel to an upper surface of the second microstructural element, the second microstructural element having a second mating edge, the second mating edge disposed adjacent the first mating edge;
- and
- a jumper having a plurality of fused layers of a material, the jumper disposed at the upper surfaces of the first and second microstructural elements at a location spanning the first and second mating edges and attached to each of the first and second microstructural elements to join the first and second microstructural elements to one another.
A microstructure, comprising:
- a first microstructural element having a plurality of fused layers of a material, each layer parallel to an upper surface of the first microstructural element, the first microstructural element having a first mechanical interlocking feature disposed at an edge thereof;
- and a second microstructural element having a plurality of fused layers of a material, each layer parallel to an upper surface of the second microstructural element, the second microstructural element having a second mechanical interlocking feature disposed an edge thereof and interlocked with the first mechanical interlocking feature to join the first and second microstructural elements.
A microstructure comprising a first microstructural element having a plurality of fused layers of a material arranged to provide a hole having a plurality of circumferential arcs disposed about the periphery thereof, each circumferential arc disposed in a separate layer of the fused layers, and each of the circumferential arcs disposed at an angularly offset location from one another.
A method of forming a microstructure by a sequential build process, comprising depositing a plurality of layers over a substrate, wherein the layers comprise one or more of a metal material and a sacrificial material, thereby forming a structure above the substrate, the structure comprising a plurality of fused layers of the metal material arranged to provide a hole having a plurality of circumferential arcs disposed about the periphery thereof, each circumferential arc disposed in a separate layer of the metal layers, and each of the circumferential arcs disposed at an angularly offset location from one another.
A method of forming a microstructure by a sequential build process, comprising depositing a plurality of layers over a substrate, wherein the layers comprise one or more of a metal material and a sacrificial material, thereby forming a structure above the substrate, the structure comprising a plurality of fused layers of the metal having circumferential arcs disposed in separate layers of the metal in angularly offset locations from one another to provide a stepwise threaded screw.
Dependencies are inferred from the claim text.