US 2018/0123206 A1Published application

Signal transmission component and electronic device

AssigneeMurata Manufacturing Co., Ltd.

InventorKuniaki YOSUI

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Abstract

A signal transmission cable as a signal transmission component includes a laminate including a first thin portion on one of the opposite ends in a first direction and a second thin portion on the other end in the first direction. A portion between the first thin portion and the second thin portion in the laminate is a main line portion. The thickness of the first and second thin portions is thinner than the thickness of the main line portion. The surface on one end in the thickness direction of the laminate defined by the main line portion and the first and second thin portions is a continuous flat surface. A connector for external connection is arranged on the surfaces of the first and second thin portions, on the sides in which each of the thin portions and the main line portion have a difference in level.

Claims17

Dependent claims

A signal transmission component comprising:

a laminate including a plurality of dielectric layers that are laminated on each other, the plurality of dielectric layers each including a conductor pattern with a flat film shape and having flexibility;
a signal conductor that is defined, in the laminate, by the conductor pattern, has a linear shape, and extends in a direction perpendicular to a lamination direction of the laminate;
a first ground conductor and a second ground conductor that are defined by a conductor pattern different from the signal conductor, in an extending direction so as to extend parallel or substantially parallel to the signal conductor, have a flat film shape, and hold the signal conductor between the first ground conductor and the second ground conductor in the lamination direction;
and
a connector for external connection that is connected to at least one of opposite ends of the signal conductor, wherein the laminate includes a thinned portion of which a thickness in the lamination direction is reduced an end portion;
no first ground conductor is located at the thinned portion;
the signal conductor is connected to the connector for external connection at the end portion;
the connector for external connection is located on a surface of the thinned portion, on a side in which the thinned portion causes the laminate to have a difference in level;
and
the laminate is bent in the lamination direction at the thinned portion.

7 more elements

An electronic device comprising:

a signal transmission component, and
a mother substrate;
wherein
the signal transmission component includes:
a laminate including a plurality of dielectric layers that are laminated on each other, the plurality of dielectric layers each including a conductor pattern with a flat film shape and having flexibility;
a signal conductor that is defined, in the laminate, by the conductor pattern, has a linear shape, and extends in a direction perpendicular to a lamination direction of the laminate;
a first ground conductor and a second ground conductor that are defined by a conductor pattern different from the signal conductor, in an extending direction so as to extend parallel or substantially parallel to the signal conductor, have a flat film shape, and hold the signal conductor between the first ground conductor and the second ground conductor in the lamination direction;
and
a connector for external connection that is connected to at least one of opposite ends of the signal conductor;
wherein
the laminate includes a thinned portion of which a thickness in the lamination direction is reduced an end portion;
no first ground conductor is located at the thinned portion;
the signal conductor is connected to the connector for external connection at the end portion;
the laminate is bent in the extending direction to the lamination direction;
the connector for external connection is located on a surface of the thinned portion, on a side in which the thinned portion causes the laminate to have a difference in level;
the laminate is bent in the lamination direction at the thinned portion;
the mother substrate includes a mounting connector to which the connector for external connection is connected;
the mounting connector is located on a side of a surface, on which the connector for external connection is connected, of the mother substrate;
and
the connector for external connection is connected to the mounting connector with the signal transmission component being bent.

17 more elements

Dependencies are inferred from the claim text.

Facts

Application: 15/856,122Filed 28 Dec 2017
Priority: JP 2013-25674612 Dec 2013
Published: 3 May 2018
Term ends: Not estimatedThe source records don’t support an estimate.

Classification19 codes

H01P 3/08
With two longitudinal conductors: microstrips; Strip lines
H01P 3/085
Microstrips; Strip lines: triplate lines
H01P 5/028
Transitions between lines of the same kind and shape, but with different dimensions: between strip lines
H05K 1/118
Printed elements for providing electric connections to or between printed circuits: specially for flexible printed circuits, e.g. using folded…

Family

Application14/938,881Continuation · filed 12 Nov 2015
Application15/856,122Continuation
US 10,038,231 B2Related patent
US 2016/0064793 A1Published application
US 9,899,719 B2Related patent
US 2018/0123206 A1This patent

From the US filing history. Foreign family members aren’t listed.