Method of forming a package
AssigneeMurata Manufacturing Co., Ltd.
InventorsKazuhito HATTA, Mashio SHIBUYA
Life of this patent
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Abstract
A method of forming a package is provided and includes providing two laminate edge portions of the package, each of which includes a foil layer between first and second resin layers; and welding together the respective first resin layers at a first position spaced apart from the edges while not welding the respective first resin layers at the edges, wherein the edge portions include edges from which electrode terminals extend such that portions of the electrode terminals are exposed beyond the edges, and wherein the edge portions are between a sealing portion and exposed portions of positive and negative electrode terminals.
Claims9
A method of forming a package, comprising:
- providing two laminate edge portions of the package, each of which includes a foil layer between first and second resin layers such that the respective first resin layers face each other and the respective second resin layers face away from each other and such that edges of the edge portions are in registration;
- and
- welding together the respective first resin layers at a first position spaced apart from the edges while not welding the respective first resin layers at the edges such that, given a thickness of each laminate edge portion before being subjected to heat and compression is represented by t, a thickness of laminate portions at the first position is represented by t1, and a thickness of laminate portions at the edges thereof is represented by t2, then, t1<2t<t2,
- wherein the edge portions include edges from which electrode terminals extend such that portions of the electrode terminals are exposed beyond the edges, and
- wherein the edge portions are between a sealing portion and exposed portions of positive and negative electrode terminals.
Dependencies are inferred from the claim text.