Led package, light emitting device and method for manufacturing led package

A light-emitting device comprising:

• an LED element including an element electrode on a bottom surface;
• a phosphor layer containing a phosphor and covering a top surface and a side surface of the LED element;
• an auxiliary electrode having an upper face bonded to a lower face of the element electrode;
• and
• a mounting substrate having a conductive pattern, to which the auxiliary electrode is connected, formed thereon, wherein
• the auxiliary electrode is larger than the element electrode,
• the auxiliary electrode includes a step that makes a lower face smaller than the upper face,
• an end portion of the auxiliary electrode on a side where the step is formed is located inside an outer peripheral side of the phosphor layer, and
• side faces of the auxiliary electrode are exposed without being covered by the phosphor layer.

A method for manufacturing an LED package, comprising the steps of:

• disposing at least one metallic piece, which includes an upper face larger than an element electrode formed on a bottom surface of an LED element and a step that makes a lower face smaller than the upper face, on a substrate where at least one recess having the same shape as the metallic piece is formed;
• housing the metallic piece in the recess by vibrating the substrate;
• mounting the LED element on the metallic piece housed in the recess such that the metallic piece is connected, as an auxiliary electrode, to the element electrode of the LED element, wherein the LED element has a top surface and a side surface which are covered by a phosphor layer containing a phosphor, and the LED element including the phosphor layer has a width larger than a width of the metallic piece;
• and
• removing the LED element, to which the auxiliary electrode is connected, from the substrate.