Radiation-Emitting Semiconductor Component and Production Method of a Plurality of Semiconductor Components

An optoelectronic semiconductor component comprising:

• a semiconductor chip comprising a semiconductor layer sequence having an active region configured to generate radiation, wherein the semiconductor chip comprises a front side and a rear side opposite the front side;
• a molded body molded on to the semiconductor chip at least in some places;
• and
• a thermal connector located on a rear side of the semiconductor component, wherein the rear side of the semiconductor component is opposite the front side of the semiconductor chip, the thermal connector extending to the rear side of the semiconductor chip,
• wherein at least one electrical connection surface is located on the front side of the semiconductor chip, and
• wherein the at least one electrical connection surface is electrically-conductively connected to an electrical contact surface of the semiconductor component via a contact path running on the molded body.

A method for producing a plurality of semiconductor components, the method comprising:

• providing a plurality of semiconductor chips, each semiconductor chip comprising a front side, a rear side opposite the front side and an active region for generating radiation;
• overmolding the semiconductor chips with a molding compound in some regions to form a molded body composite, wherein the molding compound covers the rear sides;
• exposing the rear sides of the semiconductor chips in some regions;
• forming a plurality of thermal connectors, which border the rear sides of the semiconductor chips;
• and
• singulating the molded body composite into a plurality of semiconductor components, each semiconductor component comprising a semiconductor chip and a thermal connector.

An optoelectronic semiconductor component comprising:

• a semiconductor chip comprising a semiconductor layer sequence having an active region configured to generate radiation, wherein the semiconductor chip comprises a front side and a rear side opposite the front side;
• a molded body molded on to the semiconductor chip at least in some places;
• and
• a thermal connector located on a rear side of the semiconductor component, wherein the rear side of the semiconductor component is opposite the front side of the semiconductor chip, the rear side of the semiconductor component extending to the rear side of the semiconductor chip,
• wherein the front side of the semiconductor chip comprises at least one electrical connection surface, which is electrically-conductively connected to an electrical contact surface of the semiconductor component via a contact path running on the molded body,
• wherein the molded body is molded on to the rear side of the semiconductor chip in some areas, and
• wherein the molded body comprises at least one recess through which the thermal connector extends to the rear side of the semiconductor chip.