US 2018/0122996 A1Published application

LED Flip-Chip Structure

AssigneeGuangdong University of Technology

InventorsMiao He, Sipan Yang, Deping Xiong, Junnan Zhou

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Abstract

An LED flip-chip structure is provided, wherein a silica gel, a fluorescent glue, a lens, an anti-reflection film and a packaging adhesive layer is sequentially arranged on the LED chip. The silica gel and fluorescent glue are sequentially filled within an insulating reflective cup, outside which a metal reflective cup and a light absorption layer is sequentially provided. The packaging adhesive layer is filled between the reflective cup and the lens. A sapphire substrate is pretreated to form an inverted T-shaped structure, on which a layer of epitaxial wafer of ceramic film is grown, and then a layer of high temperature resistant conductive film is grown on upper surfaces of grooves at both sides. A protrusion of the inverted T-shaped structure is uniformly coated with a thermally conductive adhesive with a certain thickness.

Claims10

Dependent claims

An LED flip-chip structure, comprising:

an LED chip;
a plurality of conductive films;
a ceramic film for heat dissipation arranged below the plurality of conductive films;
a sapphire substrate arranged below the ceramic film, the sapphire substrate is raised upward at a middle portion to form a protrusion;
a plurality of bonding pads, each of the plurality of bonding pads is connected at a bottom thereof to one of the plurality of conductive films and is connected at a top thereof to the LED chip;
an insulating reflective cup arranged on and fixed connected to the plurality of conductive films;
a silica gel layer,
a fluorescent glue;
a lens;
an anti-reflection film;
and
a packaging adhesive layer,
wherein both of the LED chip and the plurality of bonding pads are located at a bottom of the insulating reflective cup;
the silica gel layer, the fluorescent glue, the lens, the anti-reflection film and the packaging adhesive layer are all arranged within the insulating reflective cup and sequentially cover the LED chip from inside out, and both of the silica gel layer, the fluorescent glue cover at least five surfaces of the LED chip.

11 more elements

Dependencies are inferred from the claim text.