Device and Method for Producing a Device
AssigneeOSRAM Opto Semiconductors GmbH
InventorNorwin von Malm
Life of this patent
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Abstract
A device and a method for producing a device are disclosed. In an embodiment the device includes a carrier and a semiconductor body arranged in a vertical direction on the carrier. The carrier includes at least one metal layer for electrically contacting the semiconductor body, a non-metallic molding layer, at least one electrically insulating insulation layer, wherein the insulation layer is arranged in the vertical direction between the semiconductor body and the molding layer and internal anchoring structures, wherein at least two layers of the metal layer, the molding layer and the insulation layer are anchored to one another by the internal anchoring structures.
Claims21
1-19. (canceled)
A device comprising:
- a carrier;
- and
- a semiconductor body arranged in a vertical direction on the carrier, the carrier comprising:
- at least one metal layer for electrically contacting the semiconductor body;
- a non-metallic molding layer;
- at least one electrically insulating insulation layer, wherein the insulation layer is arranged in the vertical direction between the semiconductor body and the molding layer;
- and
- internal anchoring structures, wherein at least two layers of the metal layer, the molding layer and the insulation layer are anchored to one another by the internal anchoring structures.
A method for producing a device with a carrier and a semiconductor body arranged in a vertical direction on the carrier, the method comprising:
- providing the semiconductor body;
- and
- forming the carrier with at least one metal layer for electrically contacting the semiconductor body, a non-metallic molding layer, at least one electrically insulating insulation layer, and internal anchoring structures, wherein at least two layers from the metal layer, the molding layer and the insulation layer are anchored together by the internal anchoring structures, and wherein the carrier is produced on the semiconductor body by applying the carrier in layers to the semiconductor body.
A device comprising:
- a carrier;
- and
- a semiconductor body arranged in a vertical direction on the carrier, the carrier comprising:
- at least one metal layer for electrically contacting the semiconductor body;
- a non-metallic molding layer;
- at least one electrically insulating insulation layer, wherein the insulation layer is arranged in the vertical direction between the semiconductor body and the molding layer;
- and
- internal anchoring structures, wherein at least two layers from the metal layer, the molding layer and the insulation layer are anchored to one another by the internal anchoring structures,
- wherein the metal layer is a connection layer having a first sub-region and a second sub-region spaced laterally from the first sub-region by an interspace, wherein the first sub-region is assigned to a first electrical polarity and the second sub-region is assigned to a second electrical polarity different from the first electrical polarity,
- wherein the connection layer is anchored to the molding layer by the internal anchoring structures,
- wherein a stabilizing layer of metal is arranged between the semiconductor body and the connection layer,
- wherein the stabilizing layer laterally completely bridges the interspace between the sub-regions.
Dependencies are inferred from the claim text.