Method for manufacturing light emitting unit

A method for manufacturing light emitting unit, comprising:

• providing a substrate;
• forming a resin layer over the substrate;
• providing a plurality of light emitting chips adhering to the resin layer, each chip having electrodes disposed at a same side thereof, wherein the resin layer at least covers a surface of each chip and exposes the electrodes;
• forming a patterned conductive layer directly contacting the electrodes of each chip;
• performing a cutting process to form at least one light emitting unit, wherein the light emitting unit at least comprises a portion of the substrate, a portion of the resin layer and one or more of the light emitting chips;
• and
• providing a carrier board having a patterned circuit layer disposed thereon, wherein the patterned conductive layer is correspondingly disposed on the patterned circuit layer so that one or more of the light emitting chips in the light emitting unit electrically connect to the patterned circuit layer via the patterned conductive layer.