Semiconductor device

A semiconductor device, comprising:

• a semiconductor element;
• a laminated substrate including
• an insulating board having a front surface, and
• a circuit board disposed on the front surface other than an outer peripheral portion of the insulating board, the circuit board having a front surface on which the semiconductor element is mounted;
• a surrounding case having an opening, and being disposed on the outer peripheral portion of the insulating board to surround the circuit board;
• a relay substrate having a front surface and a rear surface, and a through hole passing through from the rear surface to the front surface, the relay substrate being disposed on the surrounding case to cover the opening of the surrounding case;
• and
• an external connection terminal including
• a first end portion bonded to the circuit board,
• a second end portion, opposite to the first end portion, inserted into the through hole of the relay substrate from the rear surface of the relay substrate so as to be in contact with the front surface of the relay substrate, and
• an elastically deformable elastic portion between the first end portion and the second end portion, the elastic portion extending between the first end portion and the second end portion.