Novel channel stop imp for the finfet device

Abstract

A method for manufacturing a semiconductor device includes providing a substrate structure including a substrate, a semiconductor fin on the substrate, and an isolation region on opposite sides of the semiconductor fin, the isolation region having an upper surface substantially flush with an upper surface of the at least one semiconductor fin. The method also includes implanting ions into the substrate structure to form a doped region in the semiconductor fin and in the isolation region, etching back the isolation region to expose a portion of the semiconductor fin, and performing an annealing process to activate the implanted ions in the doped region. Because the annealing is performed after the etching back of the isolation region, a portion of the implanted ions diffuses out of the isolation region and the fin, thereby reducing ion diffusion into the channel region and improving the device performance.

Dependencies are inferred from the claim text.