Substrate bonding apparatus and method of manufacturing semiconductor device using the same
AssigneeSamsung Electronics Co., Ltd.
InventorsJun Hyung KIM, Seokho KIM, SungHyup KIM, Jaegeun KIM, Taeyeong KIM
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Abstract
Disclosed are a substrate bonding apparatus and a method of manufacturing a semiconductor device. The substrate bonding apparatus comprises vacuum pumps, a first chuck engaged with the vacuum pumps and adsorbing a first substrate at vacuum pressure of the vacuum pumps, and a pushing unit penetrating a center of the first chuck and pushing the first substrate away from the first chuck. The first chuck comprises adsorption sectors providing different vacuum pressures in an azimuth direction to the first substrate.
Claims21
A substrate bonding apparatus, comprising:
- vacuum pumps;
- a first chuck connected to the vacuum pumps and configured to adsorb a first substrate at vacuum pressure of the vacuum pumps;
- and
- a pushing unit penetrating a center of the first chuck and configured to push the first substrate away from the first chuck,
- wherein the first chuck comprises a plurality of adsorption sectors providing different vacuum pressures in an azimuth direction with respect to the first substrate.
A method of manufacturing a semiconductor device, the method comprising:
- fabricating a first substrate;
- fabricating a second substrate different from the first substrate;
- and
- bonding the first substrate to the second substrate,
- wherein bonding the first substrate to the second substrate comprises providing a first portion of the second substrate with a first vacuum pressure and providing a second portion of the second substrate with a second vacuum pressure that is different from the first vacuum pressure, the first portion of the second substrate separate from the second portion of the second substrate in an azimuth direction.
A method comprising:
- providing a first substrate;
- providing a first chuck having first adsorption sectors configured to adsorb the first substrate at a first pressure and second adsorption sectors configured to adsorb the first substrate at a second pressure different from the first pressure;
- adsorbing the first substrate to the first chuck;
- and
- pushing the first substrate away from the first chuck by pushing the first substrate at a center of the first substrate.
-24. (canceled)
Dependencies are inferred from the claim text.