Carrier substrate, laminate, and method for manufacturing electronic device
AssigneeAsahi Glass Company, Limited
InventorsKazutaka ONO, Takatoshi YAOITA, Reo USUI, Kenichi EBATA, Jun AKIYAMA
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Abstract
A carrier substrate to be used, when manufacturing a member for an electronic device on a surface of a substrate, by being bonded to the substrate, includes at least a first glass substrate. The first glass substrate has a compaction described below of 80 ppm or less. Compaction is a shrinkage in a case of subjecting the first glass substrate to a temperature raising from a room temperature at 100° C./hour and to a heat treatment at 600° C. for 80 minutes, and then to a cooling to the room temperature at 100° C./hour.
Claims10
A carrier substrate to be used, when manufacturing a member for an electronic device on a surface of a substrate, by being bonded to the substrate,
- the carrier substrate comprising at least a first glass substrate,
- wherein the first glass substrate has a compaction described below of 80 ppm or less:
- compaction:
- a shrinkage in a case of subjecting the first glass substrate to a temperature raising from a room temperature at 100° C./hour and to a heat treatment at 600° C. for 80 minutes, and then to a cooling to the room temperature at 100° C./hour.
Dependencies are inferred from the claim text.