Method of manufacturing semiconductor device
AssigneeSamsung Electronics Co., Ltd.
InventorsHyung Joon KIM, Yong Seok CHO, BiO KIM, Jung Ho KIM, Joong Yun RA, Sung Hae LEE
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AssigneeSamsung Electronics Co., Ltd.
InventorsHyung Joon KIM, Yong Seok CHO, BiO KIM, Jung Ho KIM, Joong Yun RA, Sung Hae LEE
Estimating the term…
A method of manufacturing a semiconductor device includes forming a mold structure including alternately stacked mold insulating and sacrificial layers on a substrate, forming a vertical structure through the mold structure, forming side openings by removing the sacrificial, forming a preliminary dielectric layer in the side openings, forming a dielectric layer by heat-treating the preliminary dielectric layer, removing a surface layer of the dielectric layer, forming a first conductive layer covering the dielectric layer in the side openings, and forming a second conductive layer covering the first conductive layer and filling the side openings.
A method of manufacturing a semiconductor device, comprising:
A method of manufacturing a semiconductor device, comprising:
A method of manufacturing a semiconductor device, comprising:
Dependencies are inferred from the claim text.