Method for forming flash memory structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsFu-Ting SUNG, Chung-Chiang MIN, Wei-Hang HUANG, Shih-Chang LIU, Chia-Shiung TSAI
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsFu-Ting SUNG, Chung-Chiang MIN, Wei-Hang HUANG, Shih-Chang LIU, Chia-Shiung TSAI
Estimating the term…
Methods for forming semiconductor structures are provided. The method for forming the semiconductor structure includes forming a control gate over a substrate and forming a dielectric layer covering the control gate. The method further includes forming a conductive layer having a first portion and a second portion over the dielectric layer. In addition, the first portion of the conductive layer is separated from the control gate by the dielectric layer. The method further includes forming an oxide layer on a top surface of the first portion of the conductive layer and removing the second portion of the conductive layer to form a memory gate.
A method for forming a semiconductor structure, comprising:
The method for forming a semiconductor structure as claimed in claim I, further comprising:
The method for forming a semiconductor structure as claimed in claim I, further comprising:
A method for forming a semiconductor structure, comprising:
A method for forming a semiconductor structure, comprising:
Dependencies are inferred from the claim text.