Package Structure and Methods of Forming the Same

A method comprising:

• attaching a plurality of first device dies to a panel;
• forming a plurality of electrical connectors on the panel, an electrical connector adjacent to each respective first device die;
• encapsulating the plurality of first device dies and the plurality of electrical connectors with a first encapsulant;
• removing a portion of the first encapsulant to expose a respective top surface of each one of the plurality of electrical connectors and to expose a respective top surface of each one of the plurality of first device dies, wherein the exposed top surfaces of the plurality of electrical connectors are a first height above the panel, and wherein the exposed top surfaces of the plurality of first device dies are the first height above the panel;
• forming a plurality of redistribution structures over the first encapsulant, a redistribution structure over each respective one of the plurality of electrical connectors;
• attaching a plurality of second device dies to respective ones of the plurality of redistribution structures;
• and
• singulating the panel into packaged devices.

A package comprising:

• a first redistribution structure disposed on a front side of a substrate;
• a first semiconductor device disposed on the first redistribution structure, the first semiconductor device electrically connected to the first redistribution structure;
• a first encapsulant laterally surrounding the first semiconductor device;
• a second redistribution structure over and physically contacting a top surface of the first semiconductor device;
• an electrical connector extending through the first encapsulant from the first redistribution structure to the second redistribution structure, wherein a top surface of the electrical connector is level with the top surface of the first semiconductor device;
• and
• a second semiconductor device disposed on the second redistribution structure, the second semiconductor device electrically connected to the second redistribution structure.