Compact integrated device packages
AssigneeAnalog Devices, Inc.
InventorDavid Frank Bolognia
Life of this patent
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Abstract
Compact integrated device packages are disclosed. The package comprises a package substrate, a first integrated device die, and a second integrated device die. The first die and the second die are mounted and electrically connected to a first segment and a second segment of the package substrate respectively. The substrate comprises a bendable segment disposed between the first and second segment and can bend so as to angle the first die relative to the second die.
Claims20
An integrated device package sized and shaped to be disposed in a catheter assembly, the integrated device package comprising:
- a package substrate;
- a first integrated device die mounted and electrically connected to a first segment of the package substrate;
- and
- a second integrated device die mounted and electrically connected to a second segment of the package substrate, the second integrated device die spaced from the first integrated device die along a longitudinal axis of the package substrate,
- wherein the package substrate comprises a bendable segment positioned between the first segment and the second segment, the integrated device package being configured such that, during use of the integrated device package in the catheter assembly, the bendable segment bends so as to angle the first integrated device die relative to the second integrated device die at a plurality of orientations.
An integrated device package sized and shaped to be disposed in a catheter assembly having a longitudinal axis, the integrated device package comprising:
- a package substrate comprising a first segment, a second segment, a third segment and a bendable segment;
- a first integrated device die mounted and electrically connected to the first segment of the package substrate;
- and
- a second integrated device die mounted and electrically connected to the second segment of the package substrate, wherein the package substrate is bent such that the first and second dies are disposed between the first and second segments,
- wherein the bendable segment is disposed along the longitudinal axis of the catheter assembly between the first segment and the third segment, such that, during use of the integrated device package in the catheter assembly, the bendable segment bends so as to angle the first integrated device die relative to the third segment at a plurality of orientations.
A package for a catheter assembly comprising:
- an elongate package substrate having a major longitudinal dimension;
- a first plurality of electrodes at a distal portion of the elongate package substrate;
- a second plurality of contact pads at a proximal portion of the elongate package substrate, the second plurality being fewer than the first plurality;
- and
- a plurality of integrated device dies mounted to the package substrate between the distal and proximate portions of the elongate package substrate, the plurality of integrated device dies configured to process signals transduced by the first plurality of electrodes and to transmit the processed signals to the second plurality of contact pads.
Dependencies are inferred from the claim text.