Integrated circuit module and method of forming same
AssigneeStarkey Laboratories, Inc.
InventorsSayed Kaysarbin Rahim, Douglas F. Link, Susan Marie Johansson
Life of this patent
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Abstract
Various embodiments of an integrated circuit module and a method of forming such module are disclosed. The module includes a first die having an active substrate, an integrated circuit disposed on a first major surface of the active substrate, and a cavity disposed in a second major surface of the active substrate. The module also includes a second die having a first major surface, a second major surface, and a conductive pad disposed on the second major surface. The second die is disposed at least partially within the cavity of the first die such that the first major surface of the second die faces the cavity of the first die.
Claims20
An integrated circuit module, comprising:
- a first die comprising an active substrate, an integrated circuit disposed on a first major surface of the active substrate, and a cavity disposed in a second major surface of the active substrate;
- and
- a second die comprising a first major surface, a second major surface, and a conductive pad disposed on the second major surface, wherein the second die is disposed at least partially within the cavity of the first die such that the first major surface of the second die faces the cavity of the first die.
A hearing assistance device, comprising:
- a flexible circuit substrate;
- and
- an integrated circuit module disposed within the flexible circuit substrate, wherein the integrated circuit module comprises:
- a first die comprising an active substrate, an integrated circuit disposed on a first major surface of the active substrate, and a cavity disposed in a second major surface of the active substrate;
- and
- a second die comprising a first major surface, a second major surface, and a conductive pad disposed on the second major surface, wherein the second die is disposed at least partially within the cavity of the first die such that the first major surface of the second die faces the cavity of the first die.
A method of forming an integrated circuit module, comprising:
- disposing an integrated circuit on a first major surface of an active substrate wafer;
- singulating the active substrate wafer to form a first die;
- disposing a cavity in a second major surface of the active substrate of the first die;
- forming a second die, wherein the second die comprises a first major surface, a second major surface, and a conductive pad disposed on the second major surface;
- and
- disposing the second die at least partially within the cavity such that the first major surface of the second die faces the cavity.
A method, comprising:
- disposing a first die on a first flexible circuit substrate portion, wherein the first die comprises an active substrate comprising a first major surface and a second major surface, wherein an integrated circuit and a conductive pad are disposed on the first major surface of the active substrate;
- electrically connecting the conductive pad of the first die to a conductive via of the first flexible circuit substrate portion;
- disposing a cavity in the second major surface of the active substrate of the first die;
- disposing a second die on a second flexible circuit substrate portion such that a conductive pad of the second die is electrically connected to a conductive via of the second flexible circuit substrate portion;
- and
- connecting the first flexible circuit substrate portion to the second flexible circuit substrate portion such that the second die is disposed at least partially within the cavity of the first die.
Dependencies are inferred from the claim text.