Hybrid micro-circuit device with stacked chip components

Abstract

A hybrid micro-circuit device has multiple layers overlying a printed circuit board (PCB), including a first semiconductor chip component that is electrically connected to the PCB, and a second semiconductor chip component that is electrically connected to first semiconductor chip component. A molding compound surrounds the stack of components that includes the semiconductor chip components. This molding compound may include pillars that are higher than the height of the stacked components. The pillars of molded material may be configured to receive most of the stress from other components over the stacked components. The pillars of molded material may also help define a recess between the stack components and the other components that overlie the stacked components, where a thermal interface material (TIM) may be located. Further, there may be an air gap between parts of the semiconductor chip components.

Dependencies are inferred from the claim text.