Redistribution Layers in Semiconductor Packages and Methods of Forming Same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsLi-Hsien Huang, An-Jhih Su, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh
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Abstract
An embodiment package includes a first integrated circuit die, an encapsulant around the first integrated circuit die, a conductive line electrically connecting a first conductive via to a second conductive via, the conductive line including a first segment over the first integrated circuit die and having a first width, and a second segment over the first integrated circuit die having a second width larger than the first width, the second segment extending over a first boundary between the first integrated circuit die and the encapsulant.
Claims20
A package comprising:
- a first integrated circuit die;
- an encapsulant around the first integrated circuit die;
- a conductive line electrically connecting a first conductive via to a second conductive via, the conductive line comprising:
- a first segment over the first integrated circuit die and having a first width;
- and
- a second segment over the first integrated circuit die having a second width larger than the first width, the second segment extending over a first boundary between the first integrated circuit die and the encapsulant.
A method comprising:
- encapsulating a first integrated circuit die in an encapsulant;
- forming redistribution layers (RDLs) over the first integrated circuit die and the encapsulant, wherein the RDLs comprise:
- a first conductive via over the first integrated circuit die;
- and
- a conductive line electrically connecting the first conductive via to a second conductive via, the conductive line comprising:
- a first segment over the first integrated circuit die and having a first width;
- and
- a second segment extending over a boundary between the first integrated circuit die and the encapsulant, the second segment having a second width larger than the first width.
A method comprising:
- forming a first package comprising:
- forming an electrical connector over a carrier substrate;
- attaching a first die and a second die to the carrier substrate, the electrical connector extending from a back side of the first die to an active side of the first die, the active side being opposite the back side, the electrical connector being adjacent the first die and the second die;
- encapsulating the first die, the second die, and the electrical connector with a molding compound;
- and
- forming a redistribution structure overlying active sides of the first die and the second die and the molding compound, the forming the redistribution structure comprising:
- forming a first conductive via over the active side of the first die;
- forming a second conductive via over the active side of the second die;
- and
- forming a conductive line electrically connecting the first conductive via to the second conductive via, the conductive line comprising a first segment, a second segment, and a third segment, the first segment being over the first die and having a first width, the second segment extending over a first boundary between the first die and the molding compound and over a second boundary between the second die and the molding compound, the second segment having a second width larger than the first width, the third segment being over the second die and having a third width smaller than the second width.
Dependencies are inferred from the claim text.