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US 2018/0122771 A1Published application
Semiconductor packages having asymmetric chip stack structure
AssigneeSK hynix Inc.
InventorJin Kyoung PARK
Life of this patent
Estimating the term…
Abstract
A semiconductor package may include first chip stack including first chips which are stacked on a package substrate and offset to form a first reverse stepwise sidewall. The semiconductor package may include a second chip stack including second chips which are stacked on the package substrate and offset to form a second reverse stepwise sidewall. The first protrusion corner of the first chip stack may protrude toward the second chip stack.
Claims18
A semiconductor package comprising:
- a first chip stack including first chips which are stacked on a package substrate and offset in a first offset direction;
- and
- a second chip stack including second chips which are stacked on the package substrate and offset in a second offset direction corresponding to an opposite direction to the first offset direction,
- wherein a first protrusion corner of the first chip stack protruding toward the second chip stack vertically overlaps with a second protrusion corner of the second chip stack protruding toward the first chip stack, and
- wherein the first chip stack and the second chip stack are laterally aligned.
2 more elements
A semiconductor package comprising:
- a first chip stack including first chips which are stacked on a package substrate and offset to form a first reverse stepwise sidewall;
- and
- a second chip stack including second chips which are stacked on the package substrate and offset to form a second reverse stepwise sidewall,
- wherein a first protrusion corner of the first chip stack protruding toward the second chip stack vertically overlaps with a second protrusion corner of the second chip stack protruding toward the first chip stack, and
- wherein the first chip stack and the second chip stack are laterally aligned.
2 more elements
A semiconductor package comprising:
- a first chip stack including first chips which are stacked on a package substrate and offset in a first offset direction;
- a second chip stack including second chips which are stacked on the package substrate and offset in a second offset direction;
- a first spacer disposed between two adjacent chips of the first chips;
- and
- a second spacer disposed between two adjacent chips of the second chips,
- wherein a first protrusion corner of the first chip stack protrudes toward the second chip stack with a second protrusion corner of the second chip stack protruding towards the first chip stack, and a thickness of the second spacer is different from a thickness of the first spacer.
3 more elements
Dependencies are inferred from the claim text.