Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device
AssigneeSTMicroelectronics (Grenoble 2) SAS
InventorsDavid Auchere, Asma Hajji, Fabien Quercia, Jerome Lopez
Life of this patent
Estimating the term…
Abstract
An electrical connection wire connects an electrical connection pad of an electrical chip and an electrical connection pad of a carrier substrate to which the electronic chip is mounted. A dielectric layer surrounds at least the bonding wire. The dielectric layer may be a dielectric sheath or a hardened liquid dielectric material. A dielectric material may also cover at least a portion of the electrical chip and carrier substrate. A liquid electrically conductive material is deposited and hardened to form a local conductive shield surrounding the dielectric layer at the bonding wire.
Claims8
1-9. (canceled)
An electronic device, comprising:
- a carrier substrate;
- an electronic chip mounted on the carrier substrate;
- at least one electrical connection wire connecting an electrical connection pad of the carrier substrate and an electrical connection pad of the electronic chip;
- a dielectric layer made of a dielectric material on top of a zone of the electronic chip and of the carrier substrate, including the electrical connection wire and the electrical connection pads, such that the dielectric layer forms a local dielectric coating which at least partially surrounds the electrical connection wire and at least partially covers the electrical connection pads;
- and
- a local conductive shield made of an electrically conductive material at least partially covering the local dielectric coating.
14-17. (canceled)
An electronic device, comprising:
- a carrier substrate;
- an electronic chip mounted on the carrier substrate;
- a first electrical connection wire connecting between a first electrical connection pad at the carrier substrate and a second electrical connection pad at the electronic chip;
- a dielectric material which completely covers the first electrical connection wire, the first electrical connection pad and the second electrical connection pad;
- and
- an electrically conductive material that completely covers said dielectric material.
The electronic device according to claim 19, further comprising a second electrical connection wire connecting between a third electrical connection pad at the carrier substrate and a fourth electrical connection pad at the electronic chip, wherein the electrically conductive material further completely covers the second electrical connection wire, the third electrical connection pad and the fourth electrical connection pad.
Dependencies are inferred from the claim text.