Fog Bonding Device and Method Thereof

A bonding device for bonding an FPC film on a display panel through an anisotropic conductor attached to the display panel, the device comprising:

• a panel supporting unit configured to support the display panel;
• a heating and pressurizing unit disposed on an upper area of the panel supporting unit and configured to pressurize and heat a compression area of the FPC film placed on an upper part of the anisotropic conductor towards the display panel;
• a film supporting unit disposed adjacent the panel supporting unit and configured to support the FPC film;
• a film pre-heating unit provided in the film supporting unit and configured to pre-heat a non-compression area of the FPC film mounted on the film supporting unit;
• wherein the heating and pressurizing unit compresses the FPC film by heating and pressurizing the compression area of the FPC film;
• and
• wherein a dummy lead and a real lead are provided on the FPC film, the real lead extends from the compression area to the non-compression area, the dummy lead does not extend from the compression area to the non-compression area, and the real lead is only pre-heated during the pre-heating by the pre-heating unit.