Chip package structure with bump

A chip package structure, comprising:

• a redistribution substrate;
• a first chip structure over the redistribution substrate;
• a first molding layer surrounding the first chip structure, wherein the first molding layer and the first chip structure are spaced apart from the redistribution substrate by a gap;
• a first solder bump arranged between and electrically connecting the redistribution substrate and the first chip structure;
• a first conductive pillar in the gap and under the first chip structure, wherein the first solder bump is arranged between the first conductive pillar and the redistribution substrate, the first solder bump and the first conductive pillar together form an interconnect structure, and a thickness of the interconnect structure is substantially equal to a distance between the first chip structure and the redistribution substrate;
• a second chip structure over at least one of the first chip structure and the first molding layer;
• a second molding layer surrounding the second chip structure;
• and
• a third molding layer surrounding the first molding layer, the second molding layer, the first solder bump, and the first conductive pillar, and filled into the gap.

A chip package structure, comprising:

• a redistribution substrate;
• a first chip structure over the redistribution substrate;
• a first solder bump arranged between and electrically connecting the redistribution substrate and the first chip structure;
• a first molding layer surrounding the first chip structure, wherein the first molding layer and the first chip structure are spaced apart from the redistribution substrate by the first solder bump, thereby defining a gap there-between;
• a second chip structure over the first chip structure;
• a second molding layer surrounding the second chip structure;
• a conductive via structure passing through the first molding layer and electrically connected to the second chip structure;
• a second solder bump in the gap and between the conductive via structure and the redistribution substrate;
• and
• a third molding layer surrounding the first molding layer, the second molding layer, the first solder bump, and the second solder bump, and filled into the gap.