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US 2018/0122763 A1Published application
Leadless package with non-collapsible bump
AssigneeNexperia B.V.
InventorsWai Wong Chow, On Lok Chau
Life of this patent
Estimating the term…
Abstract
A leadless package semiconductor device has a top surface, a bottom surface opposite to the top surface, and multiple sidewalls between the top and bottom surfaces. At least one connection pad is disposed on the bottom surface. The connection pad includes a connection portion and at least one protrusion portion that extends from the connection portion and away from the bottom surface such that the protrusion portion and the connection portion surround a space on the bottom surface.
Claims17
A leadless semiconductor device, comprising:
- a top surface, a bottom surface opposite to the top surface, and multiple sidewalls extending between the top surface and the bottom surface;
- and
- at least one connection pad formed on the bottom surface, wherein the connection pad comprises a connection portion and at least one protrusion portion that protrudes from the connection portion, such that the at least one protrusion portion and the connection portion form a space on the bottom surface for receiving solder.
Dependencies are inferred from the claim text.