Semiconductor device and method for manufacturing the same
AssigneeSocionext Inc.
InventorHirohisa Matsuki
Life of this patent
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Abstract
A semiconductor device includes: an integrated circuit having an electrode pad; a first insulating layer disposed on the integrated circuit; a redistribution layer including a plurality of wirings and disposed on the first insulating layer, at least one of the plurality of wirings being electrically coupled to the electrode pad; a second insulating layer having a opening on at least a portion of the plurality of wirings; a metal film disposed on the opening and on the second insulating layer, and electrically coupled to at least one of the plurality of wirings; and a solder bump the solder bump overhanging at least one of the plurality of wirings not electrically coupled to the metal film.
Claims16
A semiconductor device, comprising:
- a substrate that includes a pad;
- a first wiring disposed in a redistribution layer, the first wiring being electrically connected to the pad;
- a second wiring that is separated from the first wiring, and that is disposed in same layer of the redistribution layer as the first wiring;
- and
- a first bump disposed over the first wiring and electrically connected to the first wiring, the first bump overlying the first wiring and the second wiring.
Dependencies are inferred from the claim text.