US 2018/0122759 A1 · FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE FAN-OUT SEMICONDUCTOR

Abstract

A fan-out semiconductor package includes a first connection member having a through-hole, a semiconductor chip disposed in the through-hole, the semiconductor chip having an active surface with connection pads disposed thereon and the semiconductor chip having an inactive surface opposing the active surface, an encapsulant, and a second connection member disposed on the first connection member and the active surface of the semiconductor chip, wherein the first connection member and the second connection member include redistribution layers electrically connected to the connection pads, wherein the semiconductor chip includes a first passivation layer disposed on the active surface and the semiconductor chip includes a second passivation layer disposed on the first passivation layer, and wherein the redistribution layer of the second connection member is directly formed on one surface of the second passivation layer and extends onto one surface of the first connection member.

Claims16

Dependent claims

A fan-out semiconductor package comprising:

a first connection member having a through-hole;
a semiconductor chip disposed in the through-hole, the semiconductor chip having an active surface with connection pads disposed thereon and the semiconductor chip having an inactive surface opposing the active surface;
an encapsulant encapsulating at least part of the first connection member and the inactive surface of the semiconductor chip;
and
a second connection member disposed on the first connection member and the active surface of the semiconductor chip,
wherein the first connection member and the second connection member include redistribution layers electrically connected to the connection pads,
wherein the semiconductor chip includes a first passivation layer disposed on the active surface and the semiconductor chip includes a second passivation layer disposed on the first passivation layer, and
wherein the redistribution layer of the second connection member is directly formed on one surface of the second passivation layer and extends onto one surface of the first connection member.

5 more elements

A method of manufacturing a fan-out semiconductor package, comprising:

preparing a first connection member having a through-hole and including a redistribution layer;
disposing a semiconductor chip at least partially within the through-hole, the semiconductor chip having an active surface with connection pads disposed thereon and the semiconductor chip having an inactive surface opposing the active surface, the semiconductor chip including a first passivation layer disposed on the active surface and the semiconductor chip having a second passivation layer disposed on the first passivation layer;
forming an encapsulant encapsulating at least portions of the first connection member and the inactive surface of the semiconductor chip;
and
forming a second connection member by directly forming a redistribution layer on one surface of the first connection member and one surface of the second passivation layer, the redistribution layer of the second connection member being in contact with the redistribution layer of the first connection member and the connection pads of the semiconductor chips.

2 more elements

Dependencies are inferred from the claim text.

Fan-out semiconductor package and method of manufacturing the fan-out semiconductor

Life of this patent

Fan-out semiconductor package and method of manufacturing the fan-out semiconductor

Life of this patent

Abstract

Claims16