Packaging process of electronic component

A packaging process of an electronic component, the packaging process comprising steps of:

• (a) providing a semi-package unit comprising a first insulation layer and an electronic component, wherein the electronic component is partially embedded within the first insulation layer, the electronic component comprises at least one conducting terminal disposed on a surface of the semi-package unit without being covered by the first insulation layer;
• (b) forming a metal layer over the surface of the semi-package unit and removing a part of the metal layer on the at least one conducting terminal, so that a metal mask is formed on the surface of the semi-package unit, the metal mask being directly contacted with the first insulation layer and part of the electronic component, without covering the at least one conducting terminal;
• (c) forming a metal re-distribution layer on the metal mask and the at least one conducting terminal, so that the metal mask and the at least one conducting terminal is covered by and contacted with the metal re-distribution layer;
• and
• (d) removing a part of the metal re-distribution layer and a part of the metal mask, so that at least one contact pad corresponding to the at least one conducting terminal is produced,
• wherein the step (b) comprises sub-steps of:
• forming a photoresist layer on the surface of the semi-package unit to cover the at least one conducting terminal;
• performing exposure and developing processes to remove a part of the photoresist layer, thereby defining a patterned photoresist zone corresponding to the at least one conducting terminal;
• forming the metal layer to cover the patterned photoresist zone, the first insulation layer, and the electronic component;
• and
• removing the patterned photoresist zone and a part of the metal layer overlying the patterned photoresist zone, so that the metal mask is produced and the at least one conducting terminal is exposed.