On-die seal rings

An integrated circuit (IC) formed on a die, comprising:

• fast one or more electronic circuits disposed on a semiconductor substrate that is diced from a semiconductor wafer:
• a first inner ring-like structure surrounding the first one or more electronic circuits;
• second one or more electronic circuits disposed on the semiconductor substrate;
• a second inner ring-like structure surrounding the second one or more electronic circuits, the second inner ring-like structure being spaced from the first inner seal ring by a scribe line area;
• interconnections configured to cross the scribe line area to interconnect the first, one or more electronic circuits with the second one or more electronic circuits;
• and
• an outer seal ring surrounding the first inner ring-like structure and the inner ring-like structure.

A method of forming integrated circuit (IC) on, a die, comprising:

• disposing first one or more electronic circuits on a semiconductor wafer;
• disposing second one or more electronic circuits on the semiconductor wafer;
• disposing a first inner seal ring surrounding the first one or more electronic circuits, a second inner seal ring surrounding the second one or more electronic circuits, and an outer seal ring surrounding the first inner seal ring and the second inner seal ring, the second inner seal ring being spaced from the first inner seal ring by a scribe line area;
• and
• dicing from the scribe line area to cut the outer seal ring and separate the semiconductor wafer into at least a first die with the first one or more electronic circuits, the first inner seal ring and a first partial outer seal ring on the first die, and a second die with the second one or more electronic circuits, the second inner seal ring, and a second partial outer seal ring on the second die.