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US 2018/0122751 A1Published application
Ring Structures in Device Die
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYing-Ju Chen, Jie Chen, Hsien-Wei Chen
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Abstract
A die includes a metal pad, a passivation layer over the metal pad, and a polymer layer over the passivation layer. A metal pillar is over and electrically coupled to the metal pad. A metal ring is coplanar with the metal pillar. The polymer layer includes a portion coplanar with the metal pillar and the metal ring.
Claims20
A method comprising:
- forming a die comprising:
- a metal pillar;
- a metal ring coplanar with the metal pillar;
- and
- a polymer layer comprising a first portion coplanar with the metal pillar and the metal ring, with the metal pillar and the metal ring encircled by the polymer layer;
- molding the die in a molding material;
- and
- grinding the molding material to expose a first top surface of the metal pillar and a second top surface of the metal ring.
5 more elements
A method comprising:
- forming a device die comprising:
- forming a metal pillar electrically coupling to integrated circuits formed at a top surface of a semiconductor substrate;
- and
- forming a metal ring encircling, and at a same level as, the metal pillar;
- encapsulating the device die in an encapsulating material;
- and
- forming a dielectric layer, wherein the dielectric layer comprises a bottom surface comprising:
- a first portion contacting a top surface of the encapsulating material;
- and
- a second portion, wherein a entirety top surface of the metal ring is in contact with the second portion.
7 more elements
A method comprising:
- forming a device die comprising:
- forming a seal ring over a semiconductor substrate, wherein the seal ring is proximal edges of the device die;
- and
- forming a metal pillar and a metal ring in a common process, wherein the metal ring is electrically coupled to the seal ring;
- forming a dielectric layer covering the metal pillar and the metal ring;
- encapsulating the device die in an encapsulating material;
- and
- planarizing the device die and the encapsulating material to reveal the metal pillar and the metal ring.
5 more elements
Dependencies are inferred from the claim text.