Back to results
US 2018/0122748 A1Published application
Floating package stiffener
AssigneeIntel Corporation
InventorsHao-Han Hsu, Ying Ern Ho, Jaejin Lee
Life of this patent
Estimating the term…
Abstract
Embodiments herein may relate to a package with one or more layers. A silicon die may be coupled with the one or more layers via an adhesive. A package stiffener may also be coupled with the adhesive adjacent to the die. A magnetic thin film may be coupled with the package stiffener. Other embodiments may be described and/or claimed.
Claims20
A package comprising:
- one or more layers;
- a silicon die coupled with the one or more layers via an adhesive;
- a package stiffener adjacent to the die and coupled with the adhesive on a first side of the package stiffener;
- and
- a magnetic thin film coupled with the package stiffener on a second side of the package stiffener opposite the first side;
- wherein the magnetic thin film has a magnetic loss tangent of greater than or equal to 0.1.
3 more elements
(canceled)
An electronic device package comprising:
- a motherboard;
- and
- a package coupled with the motherboard at a first side of the package, wherein the package further includes:
- a die coupled with the package via an adhesive layer on a second side of the package opposite the first side;
- a stiffener with a first side coupled with the adhesive layer adjacent to the die;
- and
- a magnetic thin film coupled with the stiffener at a second side of the stiffener opposite the first side of the stiffener;
- wherein the magnetic thin film has a magnetic loss tangent of greater than or equal to 0.1.
5 more elements
(canceled)
A method comprising:
- placing an adhesive layer on a layer of a package;
- placing a silicon die on the adhesive layer;
- placing a stiffener on the adhesive layer wherein subsequent to the placing of the silicon die and the placing of the stiffener, the stiffener and the silicon die are adjacent to one another;
- and
- placing a magnetic thin film on the stiffener such that the stiffener is between the adhesive layer and the magnetic thin film.
2 more elements
Dependencies are inferred from the claim text.