Semiconductor package assembly

A semiconductor package assembly, comprising:

• a semiconductor die mounted on a base, wherein the semiconductor die comprises:
• a radio-frequency (RF) circuit;
• and
• a first die pad electrically connected to the RF circuit;
• a substrate between the semiconductor die and the base;
• and
• a first inductor structure on the substrate, the semiconductor die or the base, wherein the inductor structure comprises:
• a first terminal electrically connected to the first die pad;
• and
• a second terminal electrically connected to a ground terminal;
• and
• an antenna on the base and electrically connected to the first die pad without passing through the first inductor structure.

A semiconductor package assembly, comprising:

• a semiconductor die mounted on a base, wherein the semiconductor die comprises:
• a radio-frequency (RF) circuit;
• and
• a first die pad electrically connected to the RF circuit;
• a substrate between the semiconductor die and the base;
• and
• a first inductor structure on the substrate, the semiconductor die or the base, wherein the inductor structure comprises:
• a first terminal electrically connected to the first die pad;
• and
• a second terminal electrically connected to ground;
• and
• an antenna on the base and electrically connected to the first die pad,
• wherein a first distance of a first conductive path from the second terminal of the first inductor structure to the first die pad is shorter than a second distance of a second conductive path from the antenna to the first die pad,
• wherein the first die pad is between the first conductive path and the second conductive path.