Cooler with emi-limiting inductor
AssigneesToyota Motor Engineering & Manufacturing North America, Inc., Virginia Tech Intellectual Properties, Inc.
InventorsKhai NGO, Chi-Ming WANG, Han CUI
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Abstract
A power device package includes a dielectric substrate having an upper conductor layer and a lower conductor layer, a semiconductor die coupled to the upper conductor layer of the dielectric substrate via conductive adhesive, a cooler including a protruding hillock having a top surface and outer sides, the lower conductor layer of the dielectric substrate being coupled to the surface of the protruding hillock via an adhesive, and a magnetic material attached mateably around the protruding hillock. The magnetic material includes inner sides abutting the outer sides of the protruding hillock.
Claims20
A power device package, comprising:
- a dielectric substrate including an upper conductor layer and a lower conductor layer;
- a semiconductor die coupled to the upper conductor layer of the dielectric substrate via conductive adhesive;
- a cooler including a protruding hillock having a top surface and outer sides, the lower conductor layer of the dielectric substrate attached to the top surface of the protruding hillock via an adhesive;
- and
- magnetic material coupled to the protruding hillock, the magnetic material includes inner sides abutting the outer sides of the protruding hillock.
A power device assembly, comprising:
- a chassis,
- a first and a second power device package, wherein the first and second power device package each include:
- a plurality of semiconductor dies, wherein each die of the plurality of semiconductor dies includes at least one transistor,
- a dielectric substrate that provides electrical connections to the plurality of semiconductor dies via a patterned conductor layer, the dielectric substrate includes a lower conductor layer insulated from the patterned conductor layer,
- a cooler that includes a plurality of hillocks each including a top surface and perimeter surfaces, at least a portion of the top surfaces of the plurality of hillocks being attached to the lower conductor layer via adhesive, and
- damping means for reducing electromagnetic interference current, wherein the damping means abut the perimeter surfaces of the plurality of hillocks;
- and
- interconnect wires that provide electrical connections between the first and second power device package.
A method of operating a power device, comprising:
- activating a DC voltage supply;
- providing a current to a plurality of semiconductor dies;
- and
- damping an electromagnetic interference current by:
- providing a magnetic material abutting hillocks of a cooler, the magnetic material amplifying inductance values of the hillocks of the cooler,
- grounding the cooler by connecting the cooler to a ground terminal, and
- providing a conduction path for the electromagnetic interference current through the cooler;
- wherein the damping of the electromagnetic interference current reduces an amount of electrical charge flowing into the ground terminal during the activation of the DC voltage supply.
Dependencies are inferred from the claim text.