Fabricating unique chips using a charged particle multi-beamlet lithography system

An electronic device created using a method of manufacturing electronic devices using a maskless lithographic exposure system using a maskless pattern writer, the method comprising:

• generating beamlet control data for controlling the maskless pattern writer to expose a wafer for creation of the electronic devices, wherein the beamlet control data is generated based on:
• design layout data defining a plurality of structures for the electronic devices to be manufactured from the wafer;
• and
• selection data defining which of the structures of the design layout data are applicable for each electronic device to be manufactured from the wafer, the selection data defining a different set of the structures for different subsets of the electronic devices,
• wherein exposure of the wafer according to the beamlet control data results in exposing a pattern having a different set of the structures for different subsets of the electronic devices.

A maskless lithographic exposure system configured to perform a method of manufacturing electronic devices using a maskless lithographic exposure system using a maskless pattern writer, the method comprising:

• generating beamlet control data for controlling the maskless pattern writer to expose a wafer for creation of the electronic devices, wherein the beamlet control data is generated based on:
• design layout data defining a plurality of structures for the electronic devices to be manufactured from the wafer;
• and
• selection data defining which of the structures of the design layout data are applicable for each electronic device to be manufactured from the wafer, the selection data defining a different set of the structures for different subsets of the electronic devices,
• wherein exposure of the wafer according to the beamlet control data results in exposing a pattern having a different set of the structures for different subsets of the electronic devices.

A lithography subsystem comprising a rasterizer and a maskless pattern writer,

• wherein the rasterizer is configured to generate beamlet control data for controlling the maskless pattern writer to expose a wafer for the creation of electronic devices, wherein the beamlet control data is generated based on:
• design layout data defining a plurality of structures for the electronic devices to be manufactured from the wafer;
• and
• selection data defining which of the structures of the design layout data are applicable for each electronic device to be manufactured from the wafer, the selection data defining a different set of the structures for different subsets of the electronic devices,
• wherein exposure of the wafer according to the beamlet control data results in exposing a pattern having a different subset of the structures for different subsets of the electronic devices.

An electronic device comprising a semiconductor chip which comprises a plurality of structures formed in a plurality of layers of the semiconductor chip,

• wherein the semiconductor chip is a member of a set of semiconductor chips, each of the semiconductor chips of the set having a set of common structures which are present in all of the semiconductor chips of the set and a set of non-common structures which are only present in a subset of the semiconductor chips of the set, and
• wherein the non-common structures include at least one of:
• connections between metal layers of the plurality of layers;
• connections between a metal layer and a gate in a contact layer of the plurality of layers;
• connections in a local interconnect layer of the plurality of layers;
• and a P- or N-doped diffusion region of a transistor or diode of one of the plurality of layers.

A computer-implemented method for generating beamlet control data for controlling a maskless pattern writer to expose a wafer for creation of electronic devices using a maskless lithographic exposure system using a maskless pattern writer such that exposure of the wafer according to the beamlet control data results in exposing a pattern having a different set of structures for different subsets of the electronic devices, the method comprising:

• receiving design layout data defining a plurality of structures for the electronic devices to be manufactured from the wafer;
• receiving selection data defining which of the structures of the design layout data are applicable for each electronic device to be manufactured from the wafer, the selection data defining a different set of the structures for different subsets of the electronic devices;
• and
• generating the beamlet control data based on the received design layout data and the received selection data.

A data processing system comprising a processor configured to perform a computer-implemented method for generating beamlet control data for controlling a maskless pattern writer to expose a wafer for creation of electronic devices using a maskless lithographic exposure system using a maskless pattern writer such that exposure of the wafer according to the beamlet control data results in exposing a pattern having a different set of structures for different subsets of the electronic devices, the method comprising:

• receiving design layout data defining a plurality of structures for the electronic devices to be manufactured from the wafer;
• receiving selection data defining which of the structures of the design layout data are applicable for each electronic device to be manufactured from the wafer, the selection data defining a different set of the structures for different subsets of the electronic devices;
• and
• generating the beamlet control data based on the received design layout data and the received selection data.