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US 2018/0122736 A1Published application
Glass fiber reinforced package substrate
OwnerDyi-Chung HUinventor
Life of this patent
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Abstract
A glass fiber layer is embedded in a thin film package substrate to reinforce the strength of the thin film package substrate. The thin film package substrate has a bottom redistribution circuitry and a top redistribution circuitry. The glass fiber layer is configured between the bottom redistribution layer and the top redistribution layer. A topmost metal pads of the bottom redistribution layer and a bottommost metal vias of the top redistribution layer are embedded in the glass fiber layer.
Claims20
A glass fiber reinforced package substrate, comprising:
- a first redistribution circuitry having a plurality of metal layers;
- a topmost metal layer of the first redistribution circuitry comprising a plurality of metal pads;
- a second redistribution circuitry configured on a top side of the first redistribution circuitry, having a plurality of metal layers;
- a bottommost metal layer of the second redistribution circuitry comprising a plurality of metal vias;
- each metal via on the bottommost metal layer of the second redistribution circuitry electrically coupled to a top surface of a corresponding metal pad of the topmost metal layer in the first redistribution circuitry;
- a glass fiber layer configured between the first redistribution circuitry and the second redistribution circuitry;
- and
- the plurality of metal pads on the topmost metal layer of the first redistribution circuitry and the plurality of metal vias on the bottommost metal layer of the second redistribution circuitry embedded in the glass fiber layer.
5 more elements
A fabrication process for a glass fiber reinforced package substrate, comprising:
- forming a release layer on a top side of a temporary carrier, and forming a first redistribution circuitry on a top side of the release layer;
- forming a glass fiber layer on a top side of the first redistribution circuitry;
- forming a plurality of opening from a top side of the glass fiber layer;
- forming a second redistribution circuitry on a top side of the glass fiber layer, to form a package substrate which comprises:
- a first redistribution circuitry having a plurality of metal layers;
- the topmost metal layer of the first redistribution circuitry comprising a plurality of metal pads;
- a second redistribution circuitry configured on a top side of the first redistribution circuitry, having a plurality of metal layers;
- a bottommost metal layer of the second redistribution circuitry comprising a plurality of metal vias;
- each metal via on the bottommost metal layer of the second redistribution circuitry electrically coupled to a top surface of a corresponding metal pad of the topmost metal layer in the first redistribution circuitry;
- a glass fiber layer configured between the first redistribution circuitry and the second redistribution circuitry;
- and
- the plurality of metal pads on the topmost metal layer of the first redistribution circuitry and the plurality of metal vias on the bottommost metal layer of the second redistribution circuitry embedded in the glass fiber layer.
9 more elements
Dependencies are inferred from the claim text.