Module assembly

A method comprising:

• providing an adapter substrate having a backside surface and a top surface opposite the backside surface;
• forming partial vias that extend partially into the adapter substrate from the top surface;
• forming a first cavity that extends partially into the adapter substrate from the top surface, the first cavity having a first bottom surface and at least one first side wall;
• forming surface traces on the top surface of the adapter substrate, wherein at least one of the partial vias is electrically connected to at least one other of the partial vias;
• each
• forming a first metallization layer on the first bottom surface of the first cavity;
• attaching a first recessed die to the first metallization layer such that the first recessed die is at least partially recessed into the first cavity, wherein a gap is formed between side portions of the first recessed die and the at least one first side wall;
• filling the gap with a gap filler such that a top surface of the gap filler is flush with the top surface of the adapter substrate and a top surface of the first recessed die;
• forming chip-to-chip interconnects over the top surface of the gap filler and between the top surface of the first recessed die and at least one of the surface traces or at least one of the partial vias to facilitate at least one electrical connection between the first recessed die and the at least one of the surface traces or the at least one of the partial vias on the adapter substrate;
• thinning the adapter substrate from the backside surface of the adapter substrate;
• attaching a surface mounted die to the top surface of the adapter substrate;
• forming interconnects on the backside surface of the adapter substrate, wherein at least a first of the interconnects directly contacts at least one of the partial vias and at least a second of the interconnects directly contacts the first metallization layer;
• and
• connecting the adapter substrate to a top surface of a packaging substrate via the interconnects.

An apparatus comprising:

• an adapter substrate having a backside surface, a top surface opposite the backside surface, and a first cavity that extends through the adapter substrate and has at least one first side wall;
• a first metallization layer formed within the first cavity;
• a first recessed die attached to the first metallization layer and mounted within the first cavity such that the first recessed die is at least partially recessed into the first cavity and surrounded by a gap filler that resides between side portions of the first recessed die and the at least one first side wall, wherein a top surface of the gap filler is flush with the top surface of the adapter substrate and a top surface of the first recessed die;
• and
• a surface mounted die attached to the top surface of the adapter substrate.