Package substrate and flip-chip package circuit including the same
AssigneePhoenix Pioneer Technology Co., Ltd.
InventorsChe-Wei Hsu, Shih-Ping Hsu
Life of this patent
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Abstract
This disclosure provides a package substrate, a flip-chip package circuit, and their fabrication methods. The package substrate includes: a first wiring layer having a first dielectric material layer and a first metal wire protruding from the first dielectric material layer; a conductive pillar layer formed on the first wiring layer and including a molding compound layer, a second dielectric material layer formed on the molding compound layer, and a metal pillar connected to the first metal wire; a second wiring layer formed on the conductive pillar layer and including a second metal wire connected to the metal pillar; and a protection layer formed on the second wiring layer.
Claims4
A method of fabricating a package substrate, comprising:
- (A) providing a carrier;
- (B) forming a first wiring layer on the carrier, wherein the first wiring layer includes a first metal wire and a first dielectric material layer filling the remaining part of the first wiring layer;
- (C) forming a conductive pillar layer on the first wiring layer, wherein the conductive pillar layer includes a molding compound layer, a second dielectric material layer formed on the molding compound layer, and a metal pillar connected to the first metal wire;
- (D) forming a second wiring layer including a second metal wire on the conductive pillar layer, so that the second metal wire is connected to the metal pillar;
- (E) forming a protection layer on the second wiring layer, and removing the carrier;
- and
- (F) removing a part of the first dielectric material layer, so that the first metal wire protrudes from the first dielectric material layer.
Dependencies are inferred from the claim text.