Plated ditch pre-mold lead frame, semiconductor package, and method of making same
AssigneeTexas Instruments Incorporated
InventorsDaiki Komatsu, Takafumi Ando
Life of this patent
Estimating the term…
Abstract
An integrated circuit chip package and method for making the same, wherein the integrated circuit chip package includes conductive leads. The method includes trenching a plurality of conductive lead structures along a parting line, plating the trenches with a plating layer, and singulating the lead frame assembly along the parting line to produce an integrated circuit chip package with conductive leads having unplated side portions and plated recessed portions.
Claims20
A method for making an integrated circuit chip package, comprising:
- providing a premolded lead frame assembly, including:
- opposing first and second sides, and
- an array of lead frames at least partially surrounded by a first molded structure, each lead frame including a die attach pad and a plurality of conductive lead structures spaced apart from the die attach pad, the first molded structure interposed at least between adjacent conductive lead structures along a parting line;
- forming a trench in at least one of the plurality of conductive lead structures along the parting line, the trench opening to the second side of the premolded lead frame assembly;
- depositing a plating layer over at least the trench;
- coupling an integrated circuit die to the plated die attach pad on the first side of the premolded lead frame assembly;
- wirebonding the integrated circuit die to the plurality of conductive lead structures on the first side of the premolded lead frame assembly;
- forming a second molded structure over the integrated circuit die and plurality of conductive lead structures;
- and
- singulating the lead frame assembly, the singulating including severing the first molded structure, the second molded structure and the plurality of conductive lead structures along the parting line resulting in an integrated circuit chip package having at least one conductive lead with a side portion and a plated recessed portion.
An integrated circuit chip package comprising:
- a premolded lead frame having a die attach pad, a plurality of conductive leads spaced apart from the die attach pad and each other, and a first molded structure interposed between the die attach pad and the plurality of conductive leads;
- an integrated circuit die coupled to the plated die attach pad and electrically coupled to the plurality of conductive leads;
- and
- a second molded structure encapsulating the integrated circuit die and at least a portion of the premolded lead frame;
- wherein the integrated circuit chip package has a top surface, a bottom surface and a plurality of side surfaces extending between the top surface and the bottom surface, at least one of the plurality of conductive leads being exposed to at least the bottom surface and one of the plurality of side surfaces.
A method for making a lead frame, comprising:
- providing an array of lead frames, each lead frame including a die attach pad and a plurality of conductive lead structures spaced apart from the die attach pad;
- forming a first molded structure at least partially between adjacent conductive lead structures along a parting line;
- etching a trench in at least one of the plurality of conductive lead structures along the parting line;
- and
- depositing a plating layer over at least the trench.
Dependencies are inferred from the claim text.