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US 2018/0122730 A1Published application
Producing wafer level packaging using leadframe strip and related device
AssigneeGlobalfoundries Inc.
InventorsRichard S. GRAF, Sudeep MANDAL, Kibby HORSFORD
Life of this patent
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Abstract
A method for producing wafer level packaging using an embedded leadframe strip and the resulting device are provided. Embodiments include placing dies into a mold with an active side of each die facing a surface of the mold; placing a leadframe strip on the mold, wherein the leadframe strip includes etched and half etched portions positioned between each die; placing a mold cover over the mold and dies; and adding mold compound in spaces between the dies and mold cover.
Claims20
A device comprising:
- dies attached to a mold;
- a leadframe strip attached to the mold, wherein the leadframe strip includes etched and half etched portions positioned between each die;
- a mold cover formed over the mold and dies;
- and
- a mold compound formed in spaces between the dies and mold cover,
- wherein the etched portions of the leadframe strip contact the mold and mold cover.
3 more elements
A device comprising:
- dies attached to a mold;
- a leadframe strip attached to the mold, wherein the leadframe strip includes etched and half etched portions positioned between each die;
- a mold cover formed over the mold and dies, wherein the etched portions of the leadframe strip are of sufficient height to contact the mold cover;
- and
- a mold compound formed in spaces between the dies and mold cover.
2 more elements
A device comprising:
- dies formed into a mold with an active side of each die facing a surface of the mold;
- a leadframe strip formed on the mold;
- a mold cover formed over the mold and dies;
- and
- a polymer mold compound formed in spaces between the dies and mold cover,
- wherein the metal leadframe strip comprises etched and half etched portions positioned between each die and the half-etched portions of the metal leadframe strip are adjacent to sides of the dies.
3 more elements
Dependencies are inferred from the claim text.