Semiconductor packages and methods for forming same
AssigneeStmicroelectronics Pte Ltd
InventorJing-En LUAN
Life of this patent
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Abstract
One or more embodiments are directed to a semiconductor package that includes an integrated heatsink and methods of forming same. In one embodiment, the semiconductor package includes a semiconductor die coupled to a first surface of a die pad. A heatsink is coupled to a second surface of the die pad. Encapsulation material is located around the die and die pad and over a portion of the heatsink. A bottom portion of the heatsink may remain exposed from the encapsulation material. Furthermore, a portion of the heatsink may extend from a side of the encapsulation material.
Claims19
A method, comprising:
- coupling heatsinks to first surfaces of die pads of a leadframe using a first adhesive material having a first melting temperature;
- after coupling the heatsinks, coupling semiconductor dice to second surfaces of the die pads using a second adhesive material having a second melting temperature, the second melting temperature being less than the first melting temperature, the second surfaces being opposite the first surfaces;
- electrically coupling the semiconductor dice to leads of the leadframe;
- and
- encapsulating the semiconductor dice, the die pads, portions of the leads, and portions of the heatsinks in an encapsulation material, wherein at least some surfaces of the heatsinks are exposed from the encapsulation material.
A method, comprising:
- placing a heatsink on a first surface of a die pad of a leadframe with a first adhesive material therebetween;
- heating the first adhesive to a temperature that is equal to or greater than 190° C. to cause the heatsink to adhere to the first surface of the die pad;
- placing a semiconductor die on a second surface of the die pad of the leadframe with a second adhesive material therebetween;
- and
- heating the second adhesive to a temperature that is equal to or less than 183° C. to cause the semiconductor die to adhere to the second surface of the die pad.
A method, comprising:
- placing a heatsink on a first surface of a die pad of a leadframe with a first adhesive material therebetween;
- heating the first adhesive to a temperature that causes the heatsink to adhere to the first surface of the die pad;
- after heating the first adhesive, placing a semiconductor die on a second surface of the die pad of the leadframe with a second adhesive material therebetween;
- and
- heating the second adhesive to a temperature that causes the semiconductor die to adhere to the second surface of the die pad, wherein heating the second adhesive does not melt the first adhesive.
Dependencies are inferred from the claim text.